Sony Cybershot lineup might be gone for good, but a new imaging-centered smartphone might be in the works. As the latest rumor has it Sony is preparing a monstrous cameraphone – the Xperia i1 Honami.
The Honami is rumored to be powered by the latest Snadpragon 800 chipset with a 2.3GHz quad-core Krait 400 processor, Adreno 330 graphics and 2GB of RAM. It should also feature a 5-inch 1080p display with Sony’s Triluminos technology (with 50% higher color gamut).The key selling point of the Honami though will be its camera. According to the leaked information we can expect a 16 to 20 megapixel 1/1.6″ camera sensor working with Sony’s BIONZ imaging processor. A xenon flash should complete the camera package.
The rest of the rumored specs include 32GB internal storage, LTE support, a 3000mAh battery unit, 10mm thickness, and water and dust resistance.
If this beast is real, it might be one of the hottest names of the holiday season. via gsmarena.com
“There’s a long list of smartphones claiming to be the “world’s thinnest” and the Huawei Ascend P6-U06 is the latest in line with a thickness of just 6.18mm. The Android-running phone is yet to be officially announced, but we’ve already seen a second batch of photos, this time showing the phone in black (there’s supposed to be a pink version too). The photos give us a better look at the sides of the Ascend P6-U06 and they seem metallic, similar to the previous iPhone design. On the right side of the device there are two card slots – microSIM and microSD presumably that require an ejector tool to open. The 3.5mm audio jack seems to be positioned on the left side. The earlier leak had some specs to go along with the image – 4.7″ 720p screen (312ppi), Android 4.1.2, 1.5HGz quad-core processor in a Hisilicon K3V2 chipset with 2GB of RAM, 8MP main camera and 2MP front-facing camera, plus 32GB of built-in storage. The Huawei Ascend P6-U06 measures 132.6 x 65.5 x 6.18mm and the weighs 120g.” via gsmarena.com